Ethylene Polymer, and Thermoplastic Resin Composition Comprising the Same, and Molded Product Obtained Therefrom

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United States of America Patent

APP PUB NO 20090270580A1
SERIAL NO

11992247

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Abstract

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The molded products of the invention including the ethylene polymers of the invention have excellent anti-blocking property and low temperature heat sealing property, as well as excellent mechanical strength and thus are suitably applicable to a film and the like.

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Patent Owner(s)

Patent OwnerAddress
MITSUI CHEMICALS INCTOKYO JAPAN TOKYO METROPOLIS
PRIME POLYMER CO LTDTOKYO 105-7117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akashi, Takahiro Ichihara-shi , JP 6 52
Endo, Koji Pasadena , US 67 628
Satoh, Yasuo Ichihara-shi , JP 65 548
Sugimura, Kenji Iwakuni-shi , JP 22 346
Tohi, Yasushi Ichihara-shi , JP 37 741

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