Methods of making a radio frequency identification (RFID) tags
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United States of America Patent
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Aug 27, 2013
Grant Date -
Nov 5, 2009
app pub date -
Jul 14, 2009
filing date -
May 31, 2001
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Abstract
Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- RUIZHANG TECHNOLOGY LIMITED COMPANY
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Credelle, Thomas Lloyd | Morgan Hill, US | 62 | 2687 |
Gengel, Glenn | Hollister, US | 11 | 891 |
Joseph, William Hill | San Leandro, US | 6 | 672 |
Stewart, Roger Green | Morgan Hill, US | 58 | 5203 |
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