Athmosphere-Controlled Bonding Apparatus, Bonding Method, and Electronic Device

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United States of America Patent

SERIAL NO

11992667

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Patent Owner(s)

Patent OwnerAddress
OHMI TADAHIRO1-17-301 KOMEGABUKURO 2-CHOME AOBA-KU SENDAI-SHI MIYAGI-KEN 980-0813

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Morimoto, Akihiro Miyagi , JP 99 893
Ohmi, Tadahiro Miyagi , JP 798 13074

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