Film coating apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Nov 12, 2009
app pub date -
Sep 28, 2007
filing date -
Sep 29, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A gas ejected from a sonic nozzle toward the rear surface of a wafer. The flow speed of the gas flowing to the outer circumference side along the rear surface of the wafer is increased between the rear surface of the wafer and a second cup and is kept by Bernoulli's effects. Thus, flapping of wafer is suppressed. Furthermore, a resist solution is prevented from flowing around to the rear surface.
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