Electronic Assemblies without Solder and Method for their Design, Prototyping, and Manufacture

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United States of America Patent

SERIAL NO

12429988

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Abstract

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which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.

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Patent Owner(s)

Patent OwnerAddress
OCCAM PORTFOLIO LLC20400 STEVENS CREEK BLVD 5TH FLOOR I P LEGAL CUPERTINO CA 95014

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fjelstad, Joseph C Maple Valley , US 86 2020
Gamini, Nader Cupertino , US 12 227
Tichane, David Sunnyvale , US 1 1

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