DRY ETCHING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090277873A1
SERIAL NO

12440671

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The object of the present invention is to provide a dry etching method which permits the reduction of the amount of any etching product formed during the etching process to thus improve the in-plane etching uniformity with respect to an object to be etched. The dry etching method comprises the steps of providing an electrode equipped with an electrode-presser member which at least comprises a surface layer composed of an yttrium-containing oxide and which is disposed on the peripheral region of the upper surface of the electrode, placing a substrate on the electrode and then subjecting the substrate to dry etching, while preventing the formation of any etching product at the peripheral region of the electrode.

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Patent Owner(s)

Patent OwnerAddress
ULVAC INC2500 HAGISONO CHIGASAKI-SHI KANAGAWA 2538543 ?2538543

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Morikawa, Yasuhiro Shizuoka , JP 30 250
Suu, Koukou Shizuoka , JP 55 882

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