Coating Mass
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United States of America Patent
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N/A
Issued Date -
Nov 12, 2009
app pub date -
Aug 23, 2006
filing date -
Aug 25, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to coating compositions for flat assemblies, hybrids, SMD assemblies, comprising at least one binder or binder mixtures which are curable at 60° C.-120° C., preferably at 70° C.-110° C., more particularly at 80° C.-90° C., and also to a process for preparing them and to their use for flat assemblies in electronics, hybrids, SMD assemblies and assembled printed circuit boards.
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