HERMETIC SEALING OF MICRO DEVICES
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United States of America Patent
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app pub date -
May 21, 2008
filing date -
May 21, 2008
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Abstract
An encapsulated device includes a micro device on a substrate, a micro chamber that encapsulates the micro device on the substrate; and a layer of hermetic-sealing material that provides at least some degree of hermeticity on one or more outer surfaces of the micro chamber to at least partially hermetically seal the micro device in the micro chamber.
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