Importance

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Abstract

An inkjet printhead assembly with a printhead integrated circuit formed on a wafer substrate, the printhead integrated circuit having an array of ink ejection nozzles, the array having a first section with nozzles for ejecting ink of a first color, and a second section with nozzles for ejecting ink of a second color. The assembly also having an integrated circuit support structure for mounting in the printer adjacent a media feed path, the integrated circuit support structure having conduits for supplying the printhead integrated circuit with ink of the first color and the second color and, a polymer sealing film between the integrated circuit support structure and the printhead integrated circuit for fixing the printhead integrated circuit to the integrated circuit support structure. The polymer sealing has apertures that allow sealed fluid communication between the conduits of the support structure carrying ink of the first color and the nozzles of the first section and sealed fluid communication between the conduits of the support structure carrying ink of the second color and the nozzles of the second section. No fluid communication exists between the first section of the array and the second section of the array. The printhead integrated circuit has channels for supplying ink to the array of ink ejection nozzles. Each of the channels being divided into channel sections by transverse walls. The apertures in the polymer sealing film are positioned at each of the transverse walls such that each of the apertures supplies ink to both the channel sections either side of one of the transverse walls.

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First Claim