WAFER CONVEYANCE METHOD AND WAFER CONVEYANCE DEVICE
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United States of America Patent
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N/A
Issued Date -
Dec 3, 2009
app pub date -
May 19, 2009
filing date -
Jun 2, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
is conveyed while keeping the planes of the wafers approximately parallel to the direction of conveyance, accordingly it is possible to reduce the increase of weight which acts upon the wafers W in the direction perpendicular to their planes caused by acceleration due to vertical shifting, horizontal shifting, or vertical vibration; and therefore it is possible to reduce the occurrence of bending of the wafers W.
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