CHIP PACKAGE FOR SEMICONDUCTOR DEVICES
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United States of America Patent
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N/A
Issued Date -
Dec 17, 2009
app pub date -
Jun 12, 2008
filing date -
Jun 12, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A chip package for semiconductor devices is provided. The chip package includes a flange configured to mount thereon a semiconductor device. The chip package further includes an inverted bridge lead frame above the flange and having a recessed area below a top portion. The inverted bridge lead frame provides semiconductor device terminal connections to at least one lead.
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