SEMICONDUCTOR WAFER

United States of America Patent

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Issued Date
Dec 17, 2009
app pub date
Jun 5, 2009
filing date
Jun 17, 2008

priority date (Note)
Abandoned

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Abstract

A semiconductor wafer with high flatness is provided. The semiconductor wafer has a diameter φ of 450 mm and a thickness of at least 900 μm and no greater than 1,100 μm.

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Patent Owner(s)

Patent Owner	Address
SUMCO CORPORATION	2-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 1058634
SUMCO TECHXIV CORPORATION	OMURA-SHI NAGASAKI 856-8555

International Classification(s)

B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
HASHII, Tomohiro	Tokyo , JP	41	170
OHMACHI, Tomoko	Nagasaki , JP	2	3
SAKAMOTO, Shinji	Nagasaki , JP	31	248
TAKAISHI, Kazushige	Tokyo , JP	49	236

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SEMICONDUCTOR WAFER

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12478860

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12478860

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