System and method for dissipating heat from a semiconductor module
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United States of America Patent
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Oct 18, 2011
Grant Date -
Dec 24, 2009
app pub date -
May 26, 2009
filing date -
Jul 8, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.
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