Production of edible wafers by extrusion
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United States of America Patent
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Oct 23, 2012
Grant Date -
Dec 24, 2009
app pub date -
Sep 10, 2007
filing date -
Sep 11, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A method for producing wafers by extrusion comprising the steps of a. Preparing an ingredient mix b. Feeding the mix in an extruder and cooking the mix c. Extruding the cooked mix such that an extruded and expanded non-planar structure is formed d. Unfolding the structure to give a large extruded sheet e. Subjecting the extruded sheet to stretching/pulling f. Adjusting the sheet in order to obtain a desired thickness g. Drying the sheet h. Separating the sheet into wafers of desired dimensions The invention also relates to the wafers thus produced and to a wafer production line.
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