METHOD FOR THE PRODUCTION OF MATERIAL BOARDS AND MATERIAL BOARD
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United States of America Patent
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Issued Date -
Dec 24, 2009
app pub date -
Jul 16, 2007
filing date -
Jul 17, 2006
priority date (Note) -
Abandoned
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Abstract
A method for the production of material plates made of chip- or fiber material, in particular of chipboard, LDF board, MDF board, HDF board, and OSB board, encompasses the following: providing dried chip- or fiber material, plasma-treating the dried chip- or fiber material, applying glue to the plasma treated chip- or fiber material, and compressing the chip- or fiber material that has glue applied into material plates. The invention also relates to such a material plate.
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