Polishing systems
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United States of America Patent
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Feb 26, 2013
Grant Date -
Dec 24, 2009
app pub date -
Jun 18, 2009
filing date -
Jun 20, 2008
priority date (Note) -
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Abstract
Described herein are polishing apparatus, polishing formulations, and polymeric substrates for use in polishing surfaces, and related methods. The apparatus, formulations, substrates, and methods may each be used in applications involving the polishing of metal and/or metal-containing surfaces such as semiconductor wafers. The apparatus, formulations, polymeric substrates, and related methods described herein may be used without abrasives, and in some instances, without mechanical friction of a pad surface against the surface to be polished. Therefore, defects on a polished surface due to such mechanical polishing processes may be reduced.
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