TRANSPONDER INCORPORATED INTO AN ELECTRONIC DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

12119466

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic device. The device comprises a metalization layer and an integrated circuit chip incorporated into the device wherein the integrated circuit chip is capacitively coupled to the metalization layer. The device comprises a first substrate having the metalization layer formed on the substrate, a cap layer covering at least the entire metalization layer and at least a portion of the first substrate not covered by the metalization layer. The integrated circuit chip is coupled to the first substrate, and is placed in proximity and in non-physical contact with the metalization layer. A conductive layer is attached to the integrated circuit chip. The conductive layer has at least a portion placed in a non-physical contact with the metalization layer. The integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

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Patent Owner(s)

Patent OwnerAddress
RUIZHANG TECHNOLOGY LIMITED COMPANYROOM 927B 9TH FLOOR NO 55 XILI ROAD FREE TRADE PILOT ZONE SHANGHAI 200051

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carrender, Curt Morgan Hill , US 17 1039

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