CARBON NANOTUBE FIBER WIRE FOR WAFER SLICING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090320819A1
SERIAL NO

12124372

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being twisted together to form the wire. Furthermore, the wire may also include diamond particles, silicon carbide particles and/or extra carbon nanotubes to enhance the abrasive properties of the wire. A method is provided for slicing a silicon boule including: linearly translating a carbon nanotube fiber wire between rotating drums while maintaining the wire under tension; using a fixture, moving the silicon boule onto the moving tensioned wire, whereby the wire cuts into the silicon; delivering lubricating fluid to the surface of the silicon where contact is made with the wire; and collecting the lubricating fluid after it leaves the surface of the silicon.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bachrach, Robert Z Burlingame, US 64 1390
Moran, John Christopher Menlo Park, US 3 17
Nalamasu, Omkaram San Jose, US 68 1559
Singh, Kaushal K Santa Clara, US 42 4878

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