INTEGRATED CIRCUIT DEVICE, SYSTEM, AND METHOD OF FABRICATION
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United States of America Patent
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N/A
Issued Date -
Dec 31, 2009
app pub date -
May 15, 2007
filing date -
May 15, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor device, comprising a first semiconductor portion having a first end, a second end, and a slit portion, wherein the width of the slit portion is less than the width of at least one of the first end and the second end; a second portion that is a different material than the first semiconductor portion, a third portions that is a different material than the first semiconductor portion, wherein the second and third portions are on opposite sides of the slit portion, and at least three terminals selected from a group consisting of a first terminal connected to the first end, a second terminal connected to the second end, a third terminal connected to the second portion, and a fourth terminal connected to the third portion.
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