METHOD FOR ASSEMBLING A DIGITIZER SENSOR
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United States of America Patent
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Issued Date -
Dec 31, 2009
app pub date -
Jun 18, 2009
filing date -
Jun 18, 2008
priority date (Note) -
Abandoned
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Abstract
A digitizer assembly includes a transparent sensor patterned with conductive elements within at least one layer, a PCB or the like patterned with conductive elements positioned along at least one edge of the transparent sensor, wherein the conductive elements at least partially match the conductive elements on the transparent sensor, and a double sided adhesive positioned between the transparent sensor and the PCB operative to mount the PCB on to the transparent sensor.
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