SEMICONDUCTOR WITH TOP-SIDE WRAP-AROUND FLANGE CONTACT
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United States of America Patent
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N/A
Issued Date -
Dec 31, 2009
app pub date -
Jun 26, 2008
filing date -
Jun 26, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method and apparatus are described for an electronic component package. A standoff is formed on an active side of a substrate. The substrate has an electronic circuit. A conductive layer is deposited over at least a portion of the active side of the substrate. The conductive layer electrically couples a contact area on the active side of the substrate. The standoff is removed to create a flexible conductor.
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