Memory Module Assembly Including Heat Sink Attached To Integrated Circuits By Adhesive And Clips
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United States of America Patent
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app pub date -
Sep 14, 2009
filing date -
Sep 29, 2004
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Abandoned
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Abstract
A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are then secured by a clip to form a rigid frame.
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