ADHESIVE LAYER FORMING LIQUID
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United States of America Patent
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Issued Date -
Jan 7, 2010
app pub date -
Jun 30, 2009
filing date -
Jul 2, 2008
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Abandoned
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Abstract
An object of the present invention is to provide an adhesive layer forming liquid about which deterioration in adhesive-layer-forming capability with the passage of time can be restrained and further the smoothness of an adhesive layer surface can be certainly kept. The adhesive layer forming liquid of the present invention is an adhesive layer forming liquid, which is a liquid for forming an adhesive layer for bonding copper and a resin to each other, and which is an aqueous solution comprising an acid, a stannic salt, a complexing agent, a stabilizer, and a complexing restrainer for restraining a complexing reaction between the complexing agent and copper.
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