INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR THE SAME
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United States of America Patent
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Issued Date -
Jan 14, 2010
app pub date -
Jul 14, 2008
filing date -
Jul 14, 2008
priority date (Note) -
Abandoned
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Abstract
The present invention discloses an inter-connecting structure for a semiconductor package and a method for the same. The inter-connecting structure for the semiconductor package comprises a substrate formed to support a die thereon; core paste formed on the substrate and adjacent to the die; and a stiffener formed in an upper portion of the core paste, wherein the hardness of the stiffener is larger than the hardness of the core paste.
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