APPARATUS AND METHOD FOR ASSEMBLING SEVERAL SEMICONDUCTOR DEVICES ONTO A TARGET SUBSTRATE
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United States of America Patent
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Issued Date -
Jan 21, 2010
app pub date -
Aug 27, 2008
filing date -
Jul 18, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus are provided for assembly of several semiconductor components on a target substrate. At least two semiconductor components are removed from a dispenser by a transfer device and simultaneously mounted in predefined target positions on the target substrate. The apparatus includes positioning units for positioning of the semiconductor components relative to the target substrate. Feed of the target substrate occurs by a first positioning unit into an assembly area where the semiconductor components are mounted on the target substrate in a first X direction, and feed of the transfer device with the semiconductor components occurs by a second positioning unit into the assembly area in a second Y direction. Both directions deviate from each other and the assembly area represents vicinity of the intersection point of the X and Y directions. Removal of the process target substrate from the assembly area continues its feed movement.
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