METHOD FOR CUTTING OR PERFORATING FILM
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United States of America Patent
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app pub date -
Aug 20, 2009
filing date -
Feb 23, 2007
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Abstract
A method of cutting or perforating a thin film (10) comprises the steps of applying an energy-absorbing material (14) at a selected location (15) or at selected locations (11) on a surface of the film, wherein the energy-absorbing material absorbs electromagnetic energy in a predetermined frequency range. Further, the method includes irradiating the energy-absorbing material at said location or said selected locations with a laser of sufficient energy in the predetermined frequency range, so as to heat the energy-absorbing material to an extent that a portion of the film adjacent to the energy-absorbing material is removed, thereby cutting the film or generating a perforation in the film.
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