INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jan 21, 2010
app pub date -
Jul 16, 2008
filing date -
Jul 16, 2008
priority date (Note) -
Abandoned
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Abstract
An integrated circuit on a substrate comprises a buffer capacitor in a buffer region. The buffer capacitor comprises a buffer electrode arranged at least partially in a recess, and a dielectric layer disposed between the buffer electrode and the substrate.
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