High frequency amplifying device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100013559A1
SERIAL NO

12012306

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Abstract

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An amplifying device includes a base plate and an integrated circuit (IC) package mounted on the base plate. The IC package includes a radio frequency (RF) output terminal and a power switching metal-oxide-semiconductor field-effect transistor (MOSFET) die mounted on the RF output terminal. The amplifying device also includes impedance matching circuitry coupled to the power switching MOSFET and the RF output terminal and an insulator substrate mounted on the base plate having thermal conductivity to provide electrical isolation and thermal transfer from the RF output terminal.

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Patent Owner(s)

Patent OwnerAddress
POWER MODULE TECHNOLOGY INC3107 NORTH DEER RUN ROAD CARSON CITY NV 89701

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Max, Lee B Tucson, US 9 68
McDonald, Robert S Reno, US 1 0

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