Encapsulation methods for interferometric modulator and MEMS devices
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United States of America Patent
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Aug 24, 2010
Grant Date -
Jan 21, 2010
app pub date -
Jul 17, 2008
filing date -
Jul 17, 2008
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Abstract
Methods and devices used for the encapsulation of MEMS devices, such as an interferometric modulator, are disclosed. Encapsulation is provided to MEMS devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer providing protection from environmental hazards, the encapsulation layer is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer.
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