RF shielding arrangement for semiconductor packages
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United States of America Patent
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Issued Date -
Jan 28, 2010
app pub date -
Jul 28, 2008
filing date -
Jul 28, 2008
priority date (Note) -
Abandoned
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Abstract
A packaging for semiconductor modules such as multi chip modules (MCM). At least one via is created on saw street region of a substrate having circuit components. The substrate is transfer molded and the transfer molded substrate is partially singulated from a first surface along with the via to create a groove. The partially singulated substrate including the groove on the saw street region and the via is coated or plated with a conducting material for RF shielding. Accordingly, the conducting material and a ground terminal of the substrate are connected through the via on the substrate.
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