Assembly for image sensing chip and assembling method thereof
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United States of America Patent
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app pub date -
Aug 1, 2008
filing date -
Aug 1, 2008
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Abstract
An assembly for an image sensing chip to reduce the entire thickness and an assembling method thereof are disclosed. Meanwhile, the electro-optical assembly includes an image sensing chip; and a multi-layer printed circuit board having a recess to accommodate the image sensing chip, thereby decreasing the entire electro-optical assembly in thickness. The image sensing chip further includes a holder mounted on the multi-layer printed circuit board for protecting the image sensing chip and a lens mounted on the holder for being pervious to light.
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