Method for Disposing Power/Ground Plane of PCB

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100030513A1
SERIAL NO

12329730

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for disposing power planes and ground planes of a printed circuit board (PCB), said method comprising the steps of: providing a PCB on which is disposed with a geometric layout and a via hole; providing a line on said PCB for intersecting said geometric layout to form a plurality of points of intersection; defining line segments by segmenting said line at each of said points of intersection to form a plurality of line segments; deleting some of said line segments having one end not being point of intersection for said geometric layout to form a plurality of segmented regions; searching a closed region by repeatedly searching region from any one of the points in said plurality of segmented regions; determining whether a closed region is a smallest closed region; determining whether a via hole is located within said smallest closed region.

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Patent Owner(s)

Patent OwnerAddress
KING YUAN ELECTRONICS CO LTDNO 81 SEC 2 GONGDAOWU RD HSINCHU CITY 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
TSAI, Ming-Chin Hsin-Chu City, TW 25 421

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