Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses

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United States of America Patent

PATENT NO 8415586
SERIAL NO

12581008

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Abstract

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In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.

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Patent Owner(s)

  • ELECTRO SCIENTIFIC INDUSTRIES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Davignon, John Hillsboro, US 3 40
Lei, Weisheng Portland, US 13 356
Matsumoto, Hisashi Hillsboro, US 59 1140
Simenson, Glenn Portland, US 20 470

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