ILLUMINATION ASSEMBLY INCLUDING CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICE
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United States of America Patent
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Issued Date -
Feb 18, 2010
app pub date -
Aug 18, 2009
filing date -
Aug 18, 2008
priority date (Note) -
Abandoned
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Abstract
The embodiments described herein are drawn generally towards illumination assemblies including light emitting devices. In some embodiments, the illumination assemblies including chip-scale packaged light-emitting devices and optical elements.
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