SEMICONDUCTOR DEVICE

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United States of America Patent

SERIAL NO

12580303

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Abstract

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A semiconductor device including: a semiconductor substrate; a first main electrode provided on a first main surface of said semiconductor substrate; a second main electrode provided on a second main surface of said semiconductor substrate, wherein a main current flows in a thickness direction of said semiconductor substrate; a trench that extends from the first main surface of said semiconductor substrate towards the second main surface; a gate insulating film covering an inner surface of said trench; and a gate electrode buried in said trench and surrounded by said gate insulating film.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI DENKI KABUSHIKI KAISHATOKYO 100-8310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KUSUNOKI, Shigeru Tokyo, JP 84 2222
TOKUDA, Norifumi Tokyo, JP 8 56

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