Two-Layered Copper-Clad Laminate
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United States of America Patent
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Issued Date -
Feb 18, 2010
app pub date -
Nov 14, 2007
filing date -
Nov 29, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A two-layered copper-clad laminate having a copper layer formed on a polyimide film by sputtering and plating, characterized in that the two-layered copper-clad laminate shows a behavior of shrinkage in MD of the copper-clad laminate and expansion in TD of the copper-clad laminate, and a warpage of the materials for the laminate is 20 mm or less, wherein the warpage represents an extent of lift of the two-layered copper-clad laminate of 100 mm square after maintaining 50% humidity at a temperature of 23° C. for 72 hours. With respect to the two-layered CCL having a copper layer provided on a polyimide film by sputtering and plating, there is provided a two-layered CCL material exhibiting a reduced warpage of the laminate and provides a method for manufacturing the same.
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