Compensation of Process-Induced Displacement
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United States of America Patent
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Issued Date -
Feb 18, 2010
app pub date -
Aug 14, 2008
filing date -
Aug 14, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing integrated circuits includes determining a process-induced displacement (e.g., a stress-induced displacement) between primary structures on a substrate and providing a photomask with mask features assigned to the primary structures. The distances between the mask features are set such that the process-induced displacement is compensated.
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