Light emitting diode structure having a textured package lens
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United States of America Patent
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Jun 7, 2011
Grant Date -
Feb 25, 2010
app pub date -
Jun 16, 2009
filing date -
Aug 20, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A light emitting diode structure and a light emitting diode structure forming method are provided. The light emitting diode structure includes a base, a diode chip, and a package lens. The diode chip is mounted on the base. The package lens covers the diode chip. The surface of the package lens includes a plurality of dot structures. The steps of the method include mounting a light-emitting diode chip on a base, assembling a package lens to cover the light emitting diodes chip, and forming a plurality of dot structures on the surface of the package lens.
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