POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF FORMING PATTERN AND SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Feb 25, 2010
app pub date -
Nov 24, 2008
filing date -
Aug 25, 2008
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Abandoned
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Abstract
Disclosed are a positive photosensitive resin composition, a method of forming a pattern using the same, and a semiconductor device having a photoresist pattern obtained by the method. The composition for positive photosensitive resin comprises a polyamide derivative, a photosensitive compound, and at least one additive having a low molecular weight.
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