METHOD FOR APPLYING AN ADHESIVE LAYER ON THIN CUT SEMICONDUCTOR CHIPS OF SEMICONDUCTOR WAFERS
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United States of America Patent
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Issued Date -
Mar 4, 2010
app pub date -
Nov 23, 2005
filing date -
Dec 9, 2004
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Abandoned
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Abstract
The invention relates to a method for applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this case, the adhesive layer, with the aid of an adhesive film which is entirely composed of precurable adhesive, is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is finally used further in the semiconductor device into which the thinned semiconductor chip is to be incorporated.
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