Importance

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Abstract

A method of micro-packaging a component wherein at least a first and a second semi-conductor substrate are provided, one of which has electrical through connections (vias). A depression in either one of the substrates or in both is etched. A component is provided above vias and connected thereto. The substrates are joined to form a sealed package. A micro-packaged electronic or micromechanic device, including a thin-walled casing of a semi-conductor material having electrical through connections through the bottom of the casing is also disclosed. An electronic or micromechanic component is attached to the electrical through connections, and the package is hermetically sealed for maintaining a desired atmosphere, suitably vacuum inside the box.

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First Claim