SEMICONDUCTOR POLISHING COMPOUND, PROCESS FOR ITS PRODUCTION AND POLISHING METHOD

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United States of America Patent

SERIAL NO

12618018

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Further, the time for polishing a pattern wafer can be shortened by using this polishing compound.

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Patent Owner(s)

Patent OwnerAddress
ASAHI GLASS COMPANY LIMITEDTOKYO 100-8405

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishida, Chie Chigasaki-shi, JP 16 301
Kon, Yoshinori Yokohoma-shi, JP 12 83
Nakazawa, Norihito Yokohoma-shi, JP 12 294

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