REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME
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United States of America Patent
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N/A
Issued Date -
Mar 11, 2010
app pub date -
Jun 20, 2006
filing date -
Jun 20, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I):are as defined in the specification, and a resin composition comprising the compound as a reactive monomer.
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