HEAT REMOVAL FACILITATED WITH DIAMOND-LIKE CARBON LAYER IN SOI STRUCTURES

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United States of America Patent

APP PUB NO 20100059762A1
SERIAL NO

12206117

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Abstract

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Described are Silicon-on-Insulator devices containing a diamond-like carbon layer, methods of making the Silicon-on-Insulator devices, and methods of using the Silicon-on-Insulator devices.

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Patent Owner(s)

Patent OwnerAddress
SPANSION LLCSUNNYVALE CA 94088-3453

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hossain, Tim Z Austin, US 31 549
Posey, Daniel E Granite Shoals, US 4 16

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