Method for packaging electronic devices and integrated circuits
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United States of America Patent
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Sep 13, 2011
Grant Date -
Mar 11, 2010
app pub date -
Jun 1, 2007
filing date -
Jul 15, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits.
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