Fabrication process for a flexible, thin thermal spreader
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United States of America Patent
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Jun 26, 2012
Issued Date -
N/A
app pub date -
Sep 12, 2008
filing date -
Sep 12, 2008
priority date (Note) -
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Abstract
The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.
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