Multilayer circuit substrate

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United States of America Patent

PATENT NO 8415565
APP PUB NO 20100065307A1
SERIAL NO

12585293

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multilayer circuit substrate includes: a laminated circuit portion in which conductive layers and resin insulating layers are alternately laminated; and a metal substrate portion, wherein the laminated circuit portion is fixed to the metal substrate portion so that at least part of a lower surface of the laminated circuit portion is in contact with at least part of an upper surface of the metal substrate portion. An electronic component is mounted on the metal substrate portion.

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Patent Owner(s)

  • JTEKT CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagase, Shigeki Nabari, JP 52 625
Nakai, Motoo Nara, JP 20 114
Sumasu, Hiroshi Kashihara, JP 22 134
Uchida, Nobuhiro Yamatotakada, JP 23 135
Yoshida, Kouya Kobe, JP 17 140

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