Method and Device for the Fracture Separation of Workpieces
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United States of America Patent
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Issued Date -
Mar 18, 2010
app pub date -
Sep 18, 2009
filing date -
Sep 18, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and device for fracture separation of a workpiece into components of the workpiece, wherein a recess is produced by a material processing device in a predetermined area of the components by removal of material from the components. The recess serves as a crack initiation site for the separation of the components. The component is heated in an area of the recess by the material processing device, and the heating takes place with a predetermined heat input in such a way that a temperature of the components does not exceed a predetermined temperature.
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