MAIN SEAL SYSTEM AND METHOD FOR USE IN AN ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Mar 18, 2010
app pub date -
Sep 15, 2008
filing date -
Sep 15, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A main sealing system (500) for use in an electronic device comprises a first half housing (501) and a second half housing (516) such that a sympathetic seal (525) is attached integrally with the first half housing (501). The second half housing (516) comprises an integrally formed compression surface (511) for biasing the sympathetic seal (525) in an outwardly manner to prevent fluid from entering a cavity (618) formed when the first half housing (501) and second half housing (516) are joined to form an enclosure for the electronic device.
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