Wire bonding method
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United States of America Patent
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Issued Date -
Mar 25, 2010
app pub date -
Sep 23, 2008
filing date -
Sep 23, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wire bonding method capable of further improving accuracy in wire bonding and realizing faster wire bonding including: transferring a semiconductor chip to a bonding center; capturing an image of a bonding point on the semiconductor chip; recognizing a position of the bonding point; performing wire bonding to the bonding point that has been corrected; capturing a post-bonding image of the semiconductor chip; transferring a next semiconductor chip to the bonding center; capturing an image of a bonding point on the next semiconductor chip; recognizing a position of the bonding point of the next semiconductor chip; and then recognizing an amount of displacement in the post-bonding image of the semiconductor chip during wire bonding to the bonding point that is of the next semiconductor chip and has been corrected.
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